One Step

With One Step desoldering braid, flux residue remaining on the board does not need to be cleaned.

• RoHS Compliant Oxide-free clean copper.
• On static-dissipative spools in compliance with the ESD Association Standard (Mil. Standard 2000 and DOD Standard 1686).
• More strands of copper (more surface area) per square inch.
• Flux residue remaining on board does not need to be cleaned.
• To be used in conjunction with processes using RMA type no-clean fluxes; conforms to the requirements of ANSI/J-STD-004, Type LO.
• High SIR—conforming to Bellcore specification GR-78-CORE (TR-TSY- 000078), and IPC Test Method III.
• Manufactured under SPC guidelines Cleaned and manufactured utilizing the latest technology in environmentally friendly chemicals and processes.