Accessories Production

 ESD trays adapted to all your components and manufacture process:
- Jedec trays
- CCGA trays
- Strip feeder trays

There are many types of trays designed to provide better mechanical and ESD protection in order to increase the efficiency and flexibility of your production lines.

JEDEC TRAYS

The outline dimensions of all JEDEC matrix trays are 12.7 x 5.35 inches (322.6 x 136mm).
Trays are configured with flat cells in the center area to allow automated handing by vacuum pick up tools.
Typical temperature ratings for bakeable JEDEC trays are: 140oC, 150oC and 180oC. Baking is typically done at 125oC. For economy use a tray with the lowest temperature rating to perform the job. Non-bakeable trays rated at 50~75oC are available

They exist in several thicknesses according to the type of case: :
- 0.25-inch (6.35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC
- 0.40-inch (10.16mm) version is available to hold thick (high) components such as PLCC, CERQUAD, PGA (Pin Grid Arrays), modules and assemblies

A scalloped indent is sculpted into one side of the tray to allow the use of a pin to mechanically fix correct orientation during use.
A 45-degree chamfer in one corner provides a visual indicator of Pin 1 orientation of the components mounted in the tray. 
JEDEC trays are stackable within the same device family and maker’s model.

SPECIFIC TRAYS FOR CCGA ( Column grid array):

The trays are designed such that the columns "float" in the center of the hole in order to protect them from damage during storage and transport.

STRIP FEEDER TRAY

Increase flexibility with ESD adjustable trays for mounting end of tapes.

Maximum capacity : 11 x 8mm tape strips
JEDEC dimensions (322.6 x 136mm)

Allows the assembly of end of tapes and avoid you to mount them on feeders and to lose components or to have to mount them manually.